iGo partners with Sun Electro Devices to scale up EV production
Indian startup iGo, which operates under iGowise Mobility, focuses on electric platforms for urban and rural markets. The company’s strategy emphasizes collaboration with existing manufacturing infrastructure instead of building new facilities from the ground up.
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Japan’s Interstellar secures $62 million in Series F Funding
Interstellar is advancing the vertical integration of its launch vehicle and satellite communications businesses. The company is developing its orbital launch vehicle, ZERO, and was selected for Phase 3 of the Japanese government’s Small Business Innovation Research (SBIR) program.
Oxford Ionics delivers quantum computer to the NQCC
QUARTET, a full-stack, trapped-ion quantum computer that leverages Oxford Ionics’ proprietary Electronic Qubit Control technology, has now been installed in the National Quantum Computing Centre’s (NQCC) quantum data centre at its Harwell campus.
Bye Aerospace partners with Electro.Aero to boost electric aviation
This partnership merges cutting-edge propulsion technology with next-generation aviation-friendly charging infrastructure, delivering scalable solutions for one of aviation’s fastest-growing segments: pilot training.
GRIDSERVE raises $135 million to advance EV charging in UK
Alongside existing equity and debt facilities, the capital, committed by TPG, Infracapital and Mitsubishi, will support GRIDSERVE in capitalising on long-term opportunities as it continues to accelerate the rollout of high power charging infrastructure across the UK’s busiest roads.
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QCi awarded TFLN photonic chip contract by US’s NIST
Quantum Computing Inc. (QCi) has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the US Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs).
Mujin partners with integrators to expand adoption of its robotics OS
With MujinOS in their toolkit, robotics system integrators are empowered to address high-mix production needs, solve unstructured logistics challenges, and reduce time-to-value for their customers.
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Polymatech completes PCB manufacturing facility in Estonia
Polymatech Electronics Limited has commissioned its new PCB manufacturing facility in Estonia, furthering the company's expansion into the European market.
Report: Trump administration discussing taking a stake in Intel
According to the Bloomberg report, the two sides were discussing a deal in which the US government would pay for a stake in the company. The White House also wants to shore up Intel’s plans to open a new manufacturing plant in Ohio.
Zelestra, EDP sign solar + BESS hybrid PPA in Spain
This agreement will allow Zelestra to build a project consisting of 170 MWdc of solar capacity and 400 MWh of battery storage in Extremadura, Spain.
TXR, iRAYPLE partner to advance robot automation technology
TXR Robotics will combine its robot control (FMS) and SLAM-based autonomous driving technology with iRAYPLE’s high-precision machine vision to implement ‘intelligent robot automation solutions’ optimized for industrial sites through technical cooperation and localization.
Ecolab to acquire Ovivo’s electronics business for $1.8 billion
The acquisition will strengthen Ecolab’s high-tech growth engine by bringing together Ovivo’s ultra-pure water technologies with Ecolab’s leading water solutions, digital technologies and global service capabilities.
Nozomi, Schneider deliver security sensor embedded in RTUs
With Nozomi Arc Embedded in Schneider SCADAPack 47xi Smart remote terminal units (RTUs), security and operations teams gain previously unavailable visibility at the control device layer of their industrial automation equipment and field assets.
PTC, Kineco to co-develop aerospace components and structures
The collaboration between the two Indian companies brings together PTC’s expertise in high-integrity castings and materials like titanium and superalloys and Kineco’s capabilities in lightweight composite structures for aerospace and defence applications.
Exail to supply navigation systems for naval UUVs to US firm
Offering precise navigation capabilities, the Phins Compact Inertial Navigation System (INS) ensures reliable performance in demanding environments and remains resilient to external signal disruptions.
Xanadu partners with DISCO to develop advanced wafer processing
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.
TTM Technologies names Edwin Roks as President and CEO
TTM Technologies has appointed Edwin Roks, Ph.D., as its new President and Chief Executive Officer, effective September 2, 2025. Dr. Roks will succeed Thomas T. Edman, who will retire after serving as CEO since 2014.
Infineon completes acquisition of Marvell's Automotive Ethernet business
Infineon Technologies has completed the acquisition of Marvell Technology's Automotive Ethernet business.
GF expands partnership with Apple
GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.
Global semiconductor sales increase 7.8% from Q1 to Q2
Global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1, reports the Semiconductor Industry Association (SIA).
Coherent sells aerospace & defence unit to Advent for $400M
Photonics specialist Coherent has entered into a definitive agreement to sell its Aerospace and Defence business to Advent, a private equity investor, for USD 400 million.
Magnachip CEO steps down as company weighs potential sale
Magnachip Semiconductor's CEO YJ Kim will step down from his role and the company's board of directors, effective immediately, as the board considers “all strategic alternatives,” including a potential sale. Board Chairman Camillo Martino has been appointed interim CEO.
Applied Materials to build $200M components plant in Arizona
Applied Materials says it will invest more than USD 200 million to build an advanced manufacturing facility in Chandler, Arizona, dedicated to producing components for semiconductor equipment.
US uses hidden trackers to monitor AI Chip shipments bound for China
US authorities have reportedly embedded concealed tracking devices in certain shipments of advanced AI chips to detect possible violations of export restrictions targeting China, according to sources cited by Reuters.
Ultraviolette raises $21M to accelerate electrification of motorcycles
The funding round was led by the corporate venture arm of Japan’s TDK Corporation. Bengaluru-based Ultraviolette is expanding its distribution network with a presence in 20 Indian cities and a target of reaching 100 cities by year-end.
Eutelsat, Tata’s Nelco to offer LEO connectivity across India
Under the agreement, OneWeb India Communications, Eutelsat’s local operating entity, will partner with Nelco to deliver secure, low-latency Low Earth Orbit (LEO) connectivity for customers on land, at sea, and in the air.
TSMC to phase out 6-inch wafer production
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.
Leadership change at Koh Young Europe
Koh Young Europe (KYE) has announced a leadership change as Harald Eppinger steps down from his role as General Manager, a position he has held for 16 years.
SuperSiC breaks ground on new manufacturing facility in Penang
SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical & Electrical (JSG), has broken ground on its new manufacturing facility in Penang, Malaysia. The facility is part of JSG’s global expansion plans and reflects the growing role of Chinese semiconductor companies in the international supply chain.
indie Semiconductor to acquire emotion3D in $20 million deal
indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.
AI to drive 2025 growth as electronics market slows into 2026
TrendForce’s latest investigations find that the global electronics market in 2025 will be sharply divided.
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